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"Liquid Cooling AI brochure"

High-density AI workloads push data centers beyond air cooling limits. With GPU demands exceeding 130 kW per rack, liquid cooling is now essential. This white paper explores thermal management strategies, including direct-to-chip cooling, distribution units, and heat rejection systems for exascale computing.

AI's growth drives demand for data center capacity, with over 200 GW of new infrastructure planned by 2030. Air-based cooling can't support power-intensive GPU workloads for AI, consuming 132 kW per rack versus 15 kW for conventional setups.

This white paper explores liquid cooling for AI-ready data centers. Learn to manage thermal challenges in high-density environments, including:

· Direct-to-chip liquid cooling for heat removal and reclamation
· Hybrid cooling combining liquid and air for performance
· Infrastructure design from coolant distribution to heat rejection

Read the white paper for cooling strategies for AI infrastructure.

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