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"7,536 kW, Tier III, IEC, Chilled Water, Liquid-cooled AI Clusters"

This design tackles AI infrastructure challenges by optimizing power and cooling for GPU clusters up to 142 kW per rack. The Tier III setup achieves a PUE of 1.09-1.16 via liquid cooling, redundancy, and lifecycle management software. Review this overview for full technical specifications.

AI factories and liquid cooling add complexity to data center planning. High-density AI clusters, reaching up to 142 kW per rack, demand purpose-built electrical and cooling systems that exceed traditional limits.

This reference design provides a validated blueprint for deploying NVIDIA GB300 NVL72-based AI clusters in a 7,536 kW Tier III facility. It features:

· Distributed redundant power with 3+1 UPS for extreme rack densities
· Dual-loop cooling with chilled water fan walls and liquid-to-liquid CDUs
· Lifecycle software for safety analysis, CFD modeling, and monitoring

Learn how this engineered approach accelerates AI infrastructure deployment in the full product overview.

Offered Free by: Schneider Electric
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