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"How to Detect Signal Integrity Issues in Chiplet Designs Early"

Accelerate Chiplet Innovation with Early SI Issue Detection

Chiplet technology is transforming semiconductor design, enabling highly integrated systems. But now designers face new signal integrity challenges.

This Keysight application note explores those challenges, including UCIe specifications, and demonstrates how EDA tools can be leveraged for successful designs.

It offers guidance on:

• Mitigating crosstalk arising from increased interconnect density.
• Ensuring signal integrity across interfaces when combining different types of dies.
• Analyzing transmission line effects and impedance matching for high-speed data transfer between chiplets.

Ready to achieve first-pass success in chiplet design?

Download the white paper today and learn how to achieve robust, reliable, and compliant designs.

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