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"Surpassing the Stringent Demands of Front-End Semiconductor Thermal Processing"

Sealing solutions for low-pressure chemical vapor deposition, rapid thermal process and epitaxial deposition systems

Discover high-performance perfluoroelastomers engineered specifically for extreme semiconductor thermal processes, including LPCVD and RTP.

By minimizing outgassing and reducing surface stiction, these materials maintain a cleaner environment for both static and semi-dynamic sealing applications. This results in increased wafer yields for process applications such as:

• LPCVD (silicon nitride, silicon oxide)
• RTP (annealing, oxidation, nitridation, silicidation)
• Epitaxial deposition
• Thermal CVD
• Atomic layer deposition
• Silicon wafer ingot growing
• SOI annealing

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