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"Best Practices for Protecting & Extending the Life of Electrostatic Chucks in Plasma Applications"

10X longer seal life for dielectric etch processes

Production of silicon wafers relies on electrostatic chucks (ESC) to hold the wafer in place during plasma etch and deposition operations. Without proper sealing design, plasma will attack the copper and polyimide layers that produce the electrostatic force, leading to costly and dangerous failures. By following best practices, ESC manufacturers and users can eliminate problems with yield loss, arcing, and unchucking. This paper will explore advances in seal materials and geometries and will provide insights into selecting the best sealing material for protecting and extending the life of electrostatic chucks in plasma applications.

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